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Proceedings Paper

Thermal modeling of thermally isolated microplates
Author(s): N. Topaloglu; P. M. Nieva; M. Yavuz; J. P. Huissoon
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Paper Abstract

In this paper we present an efficient method to calculate the thermal conductance in a thermally isolated microplate, connected to the substrate by two thin arms. The method can be applied to uncooled microbolometer pixels which in general, incorporate a thermally isolated microplate. The model approximates the microplate as a two-region slab, where heat flows in one direction. The thermal resistance that results from the constriction of the heat flux lines is added to the model as thermal contact resistance. To evaluate the model, two microplates having different dimensions were fabricated using PolyMUMPs. The experimental results are compared to the proposed model and finite element simulations. It is shown that for the tested structures, the maximum discrepancy in thermal conductance between our model and the experiments is 6%, compared to the ~22% discrepancy found using conventional models. It is concluded that the method is very effective in thermal modeling of microplates and it is applicable to uncooled microbolometer pixels.

Paper Details

Date Published: 3 April 2008
PDF: 9 pages
Proc. SPIE 6926, Modeling, Signal Processing, and Control for Smart Structures 2008, 69260U (3 April 2008); doi: 10.1117/12.776574
Show Author Affiliations
N. Topaloglu, Univ. of Waterloo (Canada)
P. M. Nieva, Univ. of Waterloo (Canada)
M. Yavuz, Univ. of Waterloo (Canada)
J. P. Huissoon, Univ. of Waterloo (Canada)

Published in SPIE Proceedings Vol. 6926:
Modeling, Signal Processing, and Control for Smart Structures 2008
Douglas K. Lindner, Editor(s)

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