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Proceedings Paper

Optimization of sensor introduction into laminated composite materials
Author(s): Kristin Schaaf; Sia Nemat-Nasser
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Paper Abstract

This work seeks to extend the functionality of the composite material beyond that of simply load-bearing and to enable in situ sensing, without compromising the structural integrity of the host composite material. Essential to the application of smart composites is the issue of the mechanical coupling of the sensor to the host material. Here we present various methods of embedding sensors within the host composite material. In this study, quasi-static three-point bending (short beam) and fatigue three-point bending (short beam) tests are conducted in order to characterize the effects of introducing the sensors into the host composite material. The sensors that are examined include three types of polyvinylidene fluoride (PVDF) thin film sensors: silver ink with a protective coating of urethane, silver ink without a protective coating, and nickel-copper alloy without a protective coating. The methods of sensor integration include placement at the midplane between the layers of prepreg material as well as a sandwich configuration in which a PVDF thin film sensor is placed between the first and second and nineteenth and twentieth layers of prepreg. Each PVDF sensor is continuous and occupies the entire layer, lying in the plane normal to the thickness direction in laminated composites. The work described here is part of an ongoing effort to understand the structural effects of integrating microsensor networks into a host composite material.

Paper Details

Date Published: 8 April 2008
PDF: 4 pages
Proc. SPIE 6932, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2008, 69321Y (8 April 2008); doi: 10.1117/12.776315
Show Author Affiliations
Kristin Schaaf, Univ. of California/San Diego (United States)
Sia Nemat-Nasser, Univ. of California/San Diego (United States)

Published in SPIE Proceedings Vol. 6932:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2008
Masayoshi Tomizuka, Editor(s)

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