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Proceedings Paper

Status of EUV reticle handling solution in meeting 32 nm HP EUV lithography
Author(s): Long He; Stefan Wurm; Phil Seidel; Kevin Orvek; Ernie Betancourt; Jon Underwood
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Paper Abstract

Significant progress has been made over the past several years in developing extreme ultraviolet (EUV) mask infrastructure, especially in EUV reticle handling and protection. Today, the industry has converged to standardize the dual pod reticle carrier approach in developing EUV reticle handling solutions. SEMATECH has already established reticle handling infrastructure compliant with industry's draft standard, including carrier, robotic carrier handling, automated carrier cleaning, vacuum protection, and state-of-the-art particulate contamination testing capabilities. It proves to be one of the key enablers in developing EUV reticle protection solutions, through broad collaboration with industry stakeholders and suppliers. In this paper, we discuss our in-house reticle handling infrastructure and provide insights on how to apply it in EUV lithography pilot line development and future production line. We present particulate contamination free baseline results of state-of-the-art EUV reticle carriers, i.e., sPod, throughout lifecycle uses. We will also compare the results against requirements for 32 nm half-pitch (HP) EUV lithography, to identify the remaining challenges ahead of the industry.

Paper Details

Date Published: 21 March 2008
PDF: 10 pages
Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69211Z (21 March 2008); doi: 10.1117/12.773278
Show Author Affiliations
Long He, SEMATECH, Inc. (United States)
Stefan Wurm, SEMATECH, Inc. (United States)
Phil Seidel, SEMATECH, Inc. (United States)
Kevin Orvek, SEMATECH, Inc. (United States)
Ernie Betancourt, SEMATECH, Inc. (United States)
Jon Underwood, SEMATECH, Inc. (United States)

Published in SPIE Proceedings Vol. 6921:
Emerging Lithographic Technologies XII
Frank M. Schellenberg, Editor(s)

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