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Proceedings Paper

Extraction and identification of resist modeling parameters for EUV lithography
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Paper Abstract

The objective of this work is to understand, from a simulation perspective, how current EUV resist chemistries compare to mature 193nm (ArF) photoresist systems. Accurate resist models for EUV resists may be developed using the same in-house calibration methodology used for ArF resists. Using this methodology, key resist properties, such as optical density, dissolution behavior, and imaging characteristics, are correlated to model parameters that have a significant impact on resist imaging performance. Such resist models, once calibrated, are used to make predictions of key lithographic metrics, such as MEF and process latitude. In this work, model calibration results for ArF and EUV resist systems are compared and the resulting resist models are used to contrast fundamental resist behavior at the ArF and EUV wavelengths.

Paper Details

Date Published: 15 April 2008
PDF: 11 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69230T (15 April 2008); doi: 10.1117/12.773122
Show Author Affiliations
Carlos A. Fonseca, Tokyo Electron America, Inc. (United States)
Roel Gronheid, IMEC (Belgium)
Steven A. Scheer, Tokyo Electron America, Inc. (United States)

Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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