Share Email Print

Proceedings Paper

Wide applications of design based metrology with tool integration
Author(s): Hyunjo Yang; Jungchan Kim; Areum Jung; Taehyeong Lee; Donggyu Yim; Jinwoong Kim; Toshiaki Hasebe; Masahiro Yamamoto
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Recently several DBMs(Design Based Metrologies) are introduced for the wafer verification and feed back to DFM. The major applications of DBM are OPC accuracy feed back, process window qualification and advanced process control feed back. In general, however, DBM brings out huge amount of measurement data and it is necessary to provide special server system for uploading and handling the raw data. And since it also takes much time and labor to analyze the raw data for valuable feed back, it is desirable to connect to EDA tools such as OPC tools or MBV(Model Based Verification) tools for data analysis. If they can communicate with a common language between them, the DBM measurement result can be sent back to OPC or MBV tools for better model calibration. For advanced process control of wafer CDU, DBM measurement results of field CDU can be fed back to scanner for illumination uniformity correction. In this work, we discuss tool integration of DBM with other tools like EDA tools. These tool integrations are targeted for the verification procedure automation and as a result for faster and more exact analysis of measurement data. The procedures of tool integration and automatic data conversion between them will be presented in detail.

Paper Details

Date Published: 25 March 2008
PDF: 7 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 692239 (25 March 2008);
Show Author Affiliations
Hyunjo Yang, Hynix Semiconductor, Inc. (South Korea)
Jungchan Kim, Hynix Semiconductor, Inc. (South Korea)
Areum Jung, Hynix Semiconductor, Inc. (South Korea)
Taehyeong Lee, Hynix Semiconductor, Inc. (South Korea)
Donggyu Yim, Hynix Semiconductor, Inc. (South Korea)
Jinwoong Kim, Hynix Semiconductor, Inc. (South Korea)
Toshiaki Hasebe, NanoGeometry Research, Inc. (Japan)
Masahiro Yamamoto, NanoGeometry Research, Inc. (Japan)

Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?