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Proceedings Paper

Tool-to-tool optical proximity effect matching
Author(s): L. Van Look; Joost Bekaert; Peter De Bisschop; Jeroen Van de Kerkhove; Geert Vandenberghe; Koen Schreel; Jasper Menger; Guido Schiffelers; Edwin Knols; Rob Willekers
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Paper Abstract

IC manufacturers have a strong demand for transferring a working process from one scanner to another. In an ideal transfer, a reticle set that produces devices within specification on a certain scanner has the same performance on another exposure tool. In real life, however, reticles employ optical proximity correction (OPC) which incorporates by definition the inherent optical fingerprint of a specific exposure tool and process. In order to avoid the additional cost of developing a new OPC model and acquiring a new reticle for each exposure tool, IC manufacturers therefore wish to "match" the optical fingerprint of their scanners as closely as possible. In this paper, we report on the matching strategy that we developed to perform a tool-to-tool matching. We present experimental matching results for several tool combinations at numerical apertures (NA) 0.75, 0.85 and 1.2. Matching of two exposure tools is obtained by determining the sensitivities to scanner parameter variations like NA, Sigma, Focus Drilling, Ellipticity and Dose from wafer data and/or simulations. These sensitivities are used to calculate the optimal scanner parameters for matching the two tools.

Paper Details

Date Published: 7 March 2008
PDF: 12 pages
Proc. SPIE 6924, Optical Microlithography XXI, 69241Q (7 March 2008); doi: 10.1117/12.772598
Show Author Affiliations
L. Van Look, IMEC vzw (Belgium)
Joost Bekaert, IMEC vzw (Belgium)
Peter De Bisschop, IMEC vzw (Belgium)
Jeroen Van de Kerkhove, IMEC vzw (Belgium)
Geert Vandenberghe, IMEC vzw (Belgium)
Koen Schreel, ASML (Netherlands)
Jasper Menger, ASML (Netherlands)
Guido Schiffelers, ASML (Netherlands)
Edwin Knols, ASML (Netherlands)
Rob Willekers, ASML (Netherlands)

Published in SPIE Proceedings Vol. 6924:
Optical Microlithography XXI
Harry J. Levinson; Mircea V. Dusa, Editor(s)

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