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Proceedings Paper

Process manufacturability evaluation for next generation immersion technology node
Author(s): M. Enomoto; T. Shimoaoki; T. Otsuka; S. Hatakeyama; K. Nafus; R. Naito; Y. Terashita; T. Shibata; H. Kosugi; M. Jyousaka; J. Mallmann; R. Maas; M. Blanco Mantecon; E. van Setten; J. Finders; S. Wang; C. Zoldesi
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Paper Abstract

In order to prepare for the next generation technology manufacturing, ASML and TEL are investigating the process manufacturability performance of the CLEAN TRACKTM LITHIUS ProTM-i/ TWINSCANTM XT:1900Gi lithocluster at the 45nm node. Previous work from this collaboration showed the feasibility of 45nm processing using the LITHIUSTM i+/TWINSCAN XT:1700i. 1 In this work, process performance with regards to critical dimension uniformity and defectivity are investigated to determine the robustness for manufacturing of the litho cluster. Specifically, at the spinner and PEB plate configuration necessary for the high volume manufacturing requirement of 180 wafers per hour, process data is evaluated to confirm the multi-module flows can achieve the required process performance. Additionally, an improvement in the edge cut strategy necessary to maximize the usable wafer surface without negative impact to defectivity is investigated.

Paper Details

Date Published: 4 April 2008
PDF: 12 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69231W (4 April 2008); doi: 10.1117/12.772552
Show Author Affiliations
M. Enomoto, Tokyo Electron Kyushu Ltd. (Japan)
T. Shimoaoki, Tokyo Electron Kyushu Ltd. (Japan)
T. Otsuka, Tokyo Electron Kyushu Ltd. (Japan)
S. Hatakeyama, Tokyo Electron Kyushu Ltd. (Japan)
K. Nafus, Tokyo Electron Kyushu Ltd. (Japan)
R. Naito, Tokyo Electron Kyushu Ltd. (Japan)
Y. Terashita, Tokyo Electron Kyushu Ltd. (Japan)
T. Shibata, Tokyo Electron Kyushu Ltd. (Japan)
H. Kosugi, Tokyo Electron Kyushu Ltd. (Japan)
M. Jyousaka, Tokyo Electron Kyushu Ltd. (Japan)
J. Mallmann, ASML Netherlands B.V. (Netherlands)
R. Maas, ASML Netherlands B.V. (Netherlands)
M. Blanco Mantecon, ASML Netherlands B.V. (Netherlands)
E. van Setten, ASML Netherlands B.V. (Netherlands)
J. Finders, ASML Netherlands B.V. (Netherlands)
S. Wang, ASML Netherlands B.V. (Netherlands)
C. Zoldesi, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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