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Proceedings Paper

Mask optimization for arbitrary patterns with 2D-TCC resolution enhancement technique
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Paper Abstract

In this paper, a new resolution enhancement technique named 2D-TCC technique is proposed. This method can enhance resolution of line patterns as well as that of contact hole patterns by the use of an approximate aerial image. The aerial image, which is obtained by 2D-TCC calculation, expresses the degree of coherence at the image plane of a projection optic considering mask transmission at the object plane. OPC of desired patterns and placement of assist patterns can be simultaneously performed according to an approximate aerial image called a 2D-TCC map. Fast calculation due to truncation of a series in calculating an aerial image is another advantage. Results of mask optimization for various line patterns and the validity of the 2D-TCC technique by simulations and experiments are reported.

Paper Details

Date Published: 7 March 2008
PDF: 12 pages
Proc. SPIE 6924, Optical Microlithography XXI, 69240F (7 March 2008); doi: 10.1117/12.771943
Show Author Affiliations
Miyoko Kawashima, Canon, Inc. (Japan)
Kenji Yamazoe, Canon, Inc. (Japan)
Yoshiyuki Sekine, Canon, Inc. (Japan)
Manabu Hakko, Canon, Inc. (Japan)
Masakatsu Ohta, Canon, Inc. (Japan)
Tokuyuki Honda, Canon, Inc. (Japan)

Published in SPIE Proceedings Vol. 6924:
Optical Microlithography XXI
Harry J. Levinson; Mircea V. Dusa, Editor(s)

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