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Proceedings Paper

Fully embedded board level optical interconnects: from point-to-point interconnection to optical bus architecture
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Paper Abstract

This paper presents the latest progress toward fully embedded board level optical interconnects in the aspect of optical bus architecture design, waveguide fabrication and device integration. A bidirectional optical bus architecture is designed and can be fabricated by a one-step pattern transfer method, which can form a large cross section multimode waveguide array with 45° micro-mirrors by silicon hard molding method. The waveguide propagation loss is reduced to 0.09dB/cm and the coupling efficiency of the metal-coated reflecting mirror is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array, and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.

Paper Details

Date Published: 8 February 2008
PDF: 9 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689903 (8 February 2008); doi: 10.1117/12.767815
Show Author Affiliations
Xiaolong Wang, Omega Optics Inc. (United States)
Ray T. Chen, Univ. of Texas at Austin (United States)

Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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