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Proceedings Paper

Wafer-level vacuum packaged resonant micro-scanning mirrors for compact laser projection displays
Author(s): Ulrich Hofmann; Marten Oldsen; Hans-Joachim Quenzer; Joachim Janes; Martin Heller; Manfred Weiss; Georgios Fakas; Lars Ratzmann; Eleonora Marchetti; Francesco D'Ascoli; Massimiliano Melani; Luca Bacciarelli; Emilio Volpi; Francesco Battini; Luca Mostardini; Francesco Sechi; Marco De Marinis; Bernd Wagner
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Paper Abstract

Scanning laser projection using resonant actuated MEMS scanning mirrors is expected to overcome the current limitation of small display size of mobile devices like cell phones, digital cameras and PDAs. Recent progress in the development of compact modulated RGB laser sources enables to set up very small laser projection systems that become attractive not only for consumer products but also for automotive applications like head-up and dash-board displays. Within the last years continuous progress was made in increasing MEMS scanner performance. However, only little is reported on how mass-produceability of these devices and stable functionality even under harsh environmental conditions can be guaranteed. Automotive application requires stable MEMS scanner operation over a wide temperature range from -40° to +85°Celsius. Therefore, hermetic packaging of electrostatically actuated MEMS scanning mirrors becomes essential to protect the sensitive device against particle contamination and condensing moisture. This paper reports on design, fabrication and test of a resonant actuated two-dimensional micro scanning mirror that is hermetically sealed on wafer level. With resonant frequencies of 30kHz and 1kHz, an achievable Theta-D-product of 13mm.deg and low dynamic deformation <20nm RMS it targets Lissajous projection with SVGA-resolution. Inevitable reflexes at the vacuum package surface can be seperated from the projection field by permanent inclination of the micromirror.

Paper Details

Date Published: 21 February 2008
PDF: 15 pages
Proc. SPIE 6887, MOEMS and Miniaturized Systems VII, 688706 (21 February 2008); doi: 10.1117/12.763433
Show Author Affiliations
Ulrich Hofmann, Fraunhofer Institute for Silicon Technology (Germany)
Marten Oldsen, Fraunhofer Institute for Silicon Technology (Germany)
Hans-Joachim Quenzer, Fraunhofer Institute for Silicon Technology (Germany)
Joachim Janes, Fraunhofer Institute for Silicon Technology (Germany)
Martin Heller, SensorDynamics AG (Germany)
Manfred Weiss, Fraunhofer Institute for Silicon Technology (Germany)
Georgios Fakas, Fraunhofer Institute for Silicon Technology (Germany)
Lars Ratzmann, Fraunhofer Institute for Silicon Technology (Germany)
Eleonora Marchetti, SensorDynamics AG (Italy)
Francesco D'Ascoli, SensorDynamics AG (Italy)
Massimiliano Melani, SensorDynamics AG (Italy)
Luca Bacciarelli, SensorDynamics AG (Italy)
Emilio Volpi, SensorDynamics AG (Italy)
Francesco Battini, SensorDynamics AG (Italy)
Luca Mostardini, SensorDynamics AG (Italy)
Francesco Sechi, SensorDynamics AG (Italy)
Marco De Marinis, SensorDynamics AG (Italy)
Bernd Wagner, Fraunhofer Institute for Silicon Technology (Germany)

Published in SPIE Proceedings Vol. 6887:
MOEMS and Miniaturized Systems VII
David L. Dickensheets; Harald Schenk, Editor(s)

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