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Proceedings Paper

Investigations on the wetting and joining behavior of Ag-based braze fillers on silicon carbide
Author(s): I. Südmeyer; M. Rohde
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Paper Abstract

A laser based process was developed for brazing different ceramics to steel with the focus on the improvement of the wetting behavior of silicon carbide SSiC which exhibits a poor wetting behavior in comparison to oxide ceramics. Therefore, the wetting behavior of this SSiC was investigated with different active braze fillers in detail. Two commercially available braze fillers were used, an AgCuTi - foil and an AgCuInTi - foil and SnAgTi - pellets produced in our institute in varying compositions were examined concerning their wetting and joining behavior towards SSiC. For improving the wetting behavior surface structures and conditioning were diversified additionally. The ceramic - steel - compounds were heated up by CO2 - laser - scanning - system. The steel sided heating calms the thermal shock for the ceramic sample and the local heat input concentrating on the joining area reduces the compound stresses to a minimum. The interfacial areas of the wetted ceramic surfaces and of the joined ceramic - steel systems were evaluated by microscopic investigations of polished cross-sections. For a better understanding of the brazing process measurements with a differential scanning calorimeter (DSC) have been performed. Moreover the compound strength of the brazed joints was determined by shear tests. In context of the strength investigations the influence of different laser induced structures (Nd:YAG) of the ceramic surfaces on the shear strength was evaluated.

Paper Details

Date Published: 23 February 2008
PDF: 6 pages
Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 68800J (23 February 2008); doi: 10.1117/12.761629
Show Author Affiliations
I. Südmeyer, Forschungszentrum Karlsruhe GmbH (Germany)
M. Rohde, Forschungszentrum Karlsruhe GmbH (Germany)

Published in SPIE Proceedings Vol. 6880:
Laser-based Micro- and Nanopackaging and Assembly II
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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