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Proceedings Paper

SU8-based static diffractive optical elements: wafer-level integration with VCSEL arrays
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Paper Abstract

With the continued miniaturization and sophistication of current generations of semiconductor devices, it is the limitations of data transfer rates that are beginning to impact system performance. Although conventional pathways continue progressing, researchers are moving toward optical interconnects as a potential solution. Optical interconnection is a promising way to replace existing global or chip-to-chip interconnects in future integrated circuits. In contrast to existing metallic wiring, optical interconnects exhibit smaller distance-related loss or distortion of the signal, no deleterious fringing effects and no heat dissipation in the interconnect itself. Pioneering interconnect schemes are currently being developed using both planar waveguides and fibers to distribute optical signals around printed circuit boards. However, researchers are now attempting to incorporate novel, freespace optical interconnects, which will boost data transfer rates by a factor of a thousand. These systems consist of a number of components including vertical cavity surface emitting lasers (VCSELs), lenses, diffractive optical elements and detectors. Integration of single components into sub-systems will help to minimize the optical system footprint for both on-chip and chip-to-chip interconnects. This paper will present the development of both independent and integrated with VCSELs,static diffractive optical element (DOEs) made of SU8 and prove the feasibility of such an approach. SU8 is a negative tone photoresist, conventionally used for high aspect ratio MEMS-based structures. Recent developments in thin film SU8 along with its low absorption at long wavelengths makes it a suitable material for optical applications. By developing a low cost lithography based process, SU-8 DOEs can be efficiently integrated directly on laser sources with minimal effect to VCSEL performance. This approach could have a significant impact on the creation of next generation optical I/O fabrics.

Paper Details

Date Published: 8 February 2008
PDF: 9 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 68990J (8 February 2008); doi: 10.1117/12.760400
Show Author Affiliations
A. Gracias, Univ. at Albany, SUNY (United States)
N. Tokranova, Univ. at Albany, SUNY (United States)
J. Castracane, Univ. at Albany, SUNY (United States)

Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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