The concept of combining the Laser MicroJet^(R) (LMJ) water jet-guided laser with a standard industrial diamond blade saw was first proposed early in 2006. The idea has now been taken a step forward with a joint project between Synova SA and Disco Hi-Tech Europe GmbH. The hybrid machine being developed integrates an LMJ module in place of the second blade saw on a Disco dual-spindle machine. The resulting machine will be fully capable of sequencing the different processes to carry out dicing of complex and layered semiconductors wafer, in any possible combination. It will be possible to program both processes to run independently in parallel or allow sequential operation during the same cutting pass. This extraordinary flexibility, combined with the speed advantages, quality of material cutting and simplification in processing in a fully automatic mode for up to 300 mm wafers, all now available in a single machine, will greatly benefit the manufacturing community. This paper will provide some insight into the design and operation of the hybrid machine and some examples of the improvements gained from its use.

Date Published: 22 February 2008
PDF: 6 pages
Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 688005 (22 February 2008); doi: 10.1117/12.760357

Published in SPIE Proceedings Vol. 6880:
Laser-based Micro- and Nanopackaging and Assembly II
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)