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Proceedings Paper

Ultrasonic infrared thermal wave nondestructive evaluation for crack detection of several aerospace materials
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Paper Abstract

The applications of ultrasonic infrared thermal wave nondestructive evaluation for crack detection of several materials, which often used in aviation alloy. For instance, steel and carbon fiber. It is difficult to test cracks interfacial or vertical with structure's surface by the traditional nondestructive testing methods. Ultrasonic infrared thermal wave nondestructive testing technology uses high-power and low-frequency ultrasonic as heat source to excite the sample and an infrared video camera as a detector to detect the surface temperature. The ultrasonic emitter launch pulses of ultrasonic into the skin of the sample, which causes the crack interfaces to rub and dissipate energy as heat, and then caused local increase in temperature at one of the specimen surfaces. The infrared camera images the returning thermal wave reflections from subsurface cracks. A computer collects and processes the thermal images according to different properties of samples to get the satisfied effect. In this paper, a steel plate with fatigue crack we designed and a juncture of carbon fiber composite that has been used in a space probe were tested and get satisfying results. The ultrasonic infrared thermal wave nondestructive detection is fast, sensitive for cracks, especially cracks that vertical with structure's surface. It is significative for nondestructive testing in manufacture produce and application of aviation, cosmography and optoelectronics.

Paper Details

Date Published: 8 January 2008
PDF: 8 pages
Proc. SPIE 6835, Infrared Materials, Devices, and Applications, 68350V (8 January 2008); doi: 10.1117/12.757015
Show Author Affiliations
Weichao Xu, Capital Normal Univ. (China)
Jingling Shen, Capital Normal Univ. (China)
Cunlin Zhang, Capital Normal Univ. (China)
Ning Tao, Capital Normal Univ. (China)
Lichun Feng, Capital Normal Univ. (China)

Published in SPIE Proceedings Vol. 6835:
Infrared Materials, Devices, and Applications
Yi Cai; Haimei Gong; Jean-Pierre Chatard, Editor(s)

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