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Proceedings Paper

The impact of mask photoresist develop on critical dimension parameters
Author(s): Adam C. Smith; Daniel B. Sullivan; Kazuhiko Sugawara; Yusuke Okawa
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Paper Abstract

As the tolerances for photomask Critical Dimension (CD) become smaller, more focus has been placed on all processes and their contribution to final mask CD. One key contributor to final mask feature dimensions is the resist develop process and it is the focus of this work. We have studied different resist develop methods to determine optimum process conditions for 45 nm critical photomasks. In searching for the optimum conditions, special consideration was made to study the influence of pattern density effects. We focused on variations in the develop nozzle. Results of the nozzles' impact on pattern density and long range pattern density effects will be presented, for both positive and negative chemically-amplified resists. A characterization of the repeatability of the processes will be presented as well.

Paper Details

Date Published: 30 October 2007
PDF: 9 pages
Proc. SPIE 6730, Photomask Technology 2007, 67300L (30 October 2007); doi: 10.1117/12.747605
Show Author Affiliations
Adam C. Smith, IBM System and Technology Group (United States)
Daniel B. Sullivan, IBM System and Technology Group (United States)
Kazuhiko Sugawara, Toppan Electronics Inc. (United States)
Yusuke Okawa, Toppan Electronics Inc. (United States)

Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)

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