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Proceedings Paper

To improve reticle re-qualification process and reduce reticle re-cleaning frequency using efficient defect classification and defect tracking
Author(s): Eric Haodong Lu; Jim Wang; Raj Badoni; Ellison Chen; Weimin Ma
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Paper Abstract

For improving productivity and reducing manufacturing cost, it is critical for wafer fabs to reduce the frequency of reticle re-clean and control the risk of missing defects of lithographic significance from overall haze defected. Haze classification and haze behavior monitoring are highly time consuming processes. Many wafer fabs skip such operations and instead re-clean reticles frequently in order to reduce the risk of missing killer haze defects. Such Reticle Re-Qual rule leads to more than necessary reticle re-cleaning, shortening the life cycle of reticles and increasing the manufacturing cost. In this paper, we investigate an efficient defect classification method - ReviewSmart, and defect auto tracking method to classify defects and efficient tracking haze growth. A solution is discussed for wafer fabs to monitor haze behaviors and improve Reticle Re-Qual rules for controlling and reducing manufacturing cost at lower risk. A total of more then 30 production reticles of critical layers of OD, Poly, Contact and Metal 1 were inspected by STARLight2TM on KLA-Tencor TeraScan SL516 system. ReviewSmart processed all the defects detected during Reticle Re-Qual inspection. The results showed significant reduction in defect review times, with 100% fidelity rate.

Paper Details

Date Published: 1 November 2007
PDF: 8 pages
Proc. SPIE 6730, Photomask Technology 2007, 67303Q (1 November 2007); doi: 10.1117/12.747195
Show Author Affiliations
Eric Haodong Lu, KLA-Tencor Corp. (United States)
Jim Wang, KLA-Tencor Corp. (Taiwan)
Raj Badoni, KLA-Tencor Corp. (United States)
Ellison Chen, KLA-Tencor Corp. (Taiwan)
Weimin Ma, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)

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