
Proceedings Paper
Industry survey of wafer fab reticle quality control strategies in the 90nm-45nm design-rule ageFormat | Member Price | Non-Member Price |
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Paper Abstract
Reticle quality control in wafer fabs is
different from quality control in mask shops. Mask
shop requirements are typically inspectability of
mask-type, resolution and sensitivity, with the latter
usually being the most important. Mask shop
sensitivity requirements are also fairly absolute. All
defects or imperfections of a certain specification
have to be found 100 percent of the time, every time.
Wafer fab requirements are an interplay between
inspectability, sensitivity, and the economic cost of
inspection versus the economic risk of not
inspecting. Early warning and defect signatures
versus absolute capture of all defects is a key
distinction between wafer fabs and mask shops. In
order to better understand the different strategies and
approaches taken by wafer fabs for reticle quality
control an industry-wide benchmark survey of
leading wafer fabs was undertaken. This paper
summarizes the results while retaining the different
wafer fabs' anonymity and confidentiality. The
approach taken for the survey was specifically
designed to be impartial and independent of any
tools, solutions or applications available from KLA-Tencor.
Paper Details
Date Published: 1 November 2007
PDF: 5 pages
Proc. SPIE 6730, Photomask Technology 2007, 67305B (1 November 2007); doi: 10.1117/12.745389
Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)
PDF: 5 pages
Proc. SPIE 6730, Photomask Technology 2007, 67305B (1 November 2007); doi: 10.1117/12.745389
Show Author Affiliations
Russell Dover, KLA-Tencor Corp. (United States)
Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)
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