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Proceedings Paper

Advanced methods for electromagnetic investigation of PCB/PWB layouts
Author(s): N. D. Codreanu; C. Ionescu; P. Svasta; V. Golumbeanu
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Paper Abstract

High Density Interconnect (HDI) technology is a way to condense electronic circuits for ruggedness, radiation hardening, and high performance. HDI minimizes the size and weight of electronic products while maximizing their performances. HDI circuits offer new solutions to signal integrity (SI) and electromagnetic compatibility (EMC) concerns, concerns which are expected to grow more and more as rise/fall times continue to drop. Because PCB manufacturers have developed new materials and technological solutions, indispensable at this moment is to perform a deep virtual characterization of structures directly related to HDI. This paper presents investigations and results focused on the main areas of SI and EMC, as noise at PCB level (reflections, and crosstalk), electromagnetic interference (EMI) and on-board interconnection delay. The authors have evaluated various HDI-PCB items and structures using the MoM full-wave electromagnetic simulation method. After modeling and simulation a link to classical circuit simulators was created by extracting RLCG elements and various parameters, which are directly related to the total current along the HDI structures. The paper offers a new way to find the solutions for keeping the integrity of signals and electromagnetic compliance.

Paper Details

Date Published: 8 May 2007
PDF: 9 pages
Proc. SPIE 6635, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies III, 663513 (8 May 2007); doi: 10.1117/12.742085
Show Author Affiliations
N. D. Codreanu, Univ. Politehnica of Bucharest (Romania)
C. Ionescu, Univ. Politehnica of Bucharest (Romania)
P. Svasta, Univ. Politehnica of Bucharest (Romania)
V. Golumbeanu, Univ. Politehnica of Bucharest (Romania)

Published in SPIE Proceedings Vol. 6635:
Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies III
Ovidiu Iancu; Adrian Manea; Paul Schiopu, Editor(s)

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