
Proceedings Paper
Compact uncooled amorphous silicon 160x120 IRFPA with 25 µm pixel-pitch for large volume applicationsFormat | Member Price | Non-Member Price |
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Paper Abstract
This paper reviews specifications and performances of a 160 x 120 uncooled infrared focal plane array made from
amorphous silicon micro bolometer with a pixel-pitch of 25 μm, integrated in a LCC package. This detector has been
specifically designed for being produced in large volume. The detector has kept all the innovations developed on the
full TV format ROIC (detector configuration by serial link, low power consumption or wide electrical dynamic range... ) and offers an advanced TEC-less focal plane array well adapted to low end thermal imaging cameras. The specific
appeal of this unit lies in the miniaturization of the packaging and its extremely light weight.In the last part of the paper,
we will look more closely at electro-optical performances of this TEC-less product 160 x 120 as well as the other 25 μm
products like the 384 x 288. We will insist on the wide thermal dynamic range and the low consumption achieved
thanks to the mastering of the amorphous silicon technology coupled with the innovation in the ROIC design.
Paper Details
Date Published: 8 October 2007
PDF: 6 pages
Proc. SPIE 6737, Electro-Optical and Infrared Systems: Technology and Applications IV, 67370Y (8 October 2007); doi: 10.1117/12.738312
Published in SPIE Proceedings Vol. 6737:
Electro-Optical and Infrared Systems: Technology and Applications IV
David A. Huckridge; Reinhard R. Ebert, Editor(s)
PDF: 6 pages
Proc. SPIE 6737, Electro-Optical and Infrared Systems: Technology and Applications IV, 67370Y (8 October 2007); doi: 10.1117/12.738312
Show Author Affiliations
J. L. Tissot, ULIS (France)
O. Legras, ULIS (France)
C. Minassian, ULIS (France)
P. Robert, ULIS (France)
B. Fieque, ULIS (France)
O. Legras, ULIS (France)
C. Minassian, ULIS (France)
P. Robert, ULIS (France)
B. Fieque, ULIS (France)
Published in SPIE Proceedings Vol. 6737:
Electro-Optical and Infrared Systems: Technology and Applications IV
David A. Huckridge; Reinhard R. Ebert, Editor(s)
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