
Proceedings Paper
Actinic inspection of sub-50 nm EUV mask blank defectsFormat | Member Price | Non-Member Price |
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Paper Abstract
A new actinic mask inspection technology to probe nano-scaled defects buried underneath a
Mo/Si multilayer reflection coating of an Extreme Ultraviolet Lithography mask blank has
been implemented using EUV Photoemission Electron Microscopy (EUV-PEEM). EUV
PEEM images of programmed defect structures of various lateral and vertical sizes recorded
at around 13 nm wavelength show that 35 nm wide and 4 nm high buried line defects are
clearly detectable. The imaging technique proves to be sensitive to small phase jumps
enhancing the visibility of the edges of the phase defects which is explained in terms of a
standing wave enhanced image contrast at resonant EUV illumination.
Paper Details
Date Published: 3 May 2007
PDF: 7 pages
Proc. SPIE 6533, 23rd European Mask and Lithography Conference, 65331R (3 May 2007); doi: 10.1117/12.736920
Published in SPIE Proceedings Vol. 6533:
23rd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)
PDF: 7 pages
Proc. SPIE 6533, 23rd European Mask and Lithography Conference, 65331R (3 May 2007); doi: 10.1117/12.736920
Show Author Affiliations
Jingquan Lin, Ludwig Maximilians Univ. (Germany)
Nils Weber, Focus GmbH (Germany)
Jochen Maul, Mainz Univ. (Germany)
Stefan Hendel, Bielefeld Univ. (Germany)
Nils Weber, Focus GmbH (Germany)
Jochen Maul, Mainz Univ. (Germany)
Stefan Hendel, Bielefeld Univ. (Germany)
Karsten Rott, Bielefeld Univ. (Germany)
Michael Merkel, Focus GmbH (Germany)
Gerd Schoenhense, Mainz Univ. (Germany)
Ulf Kleineberg, Bielefeld Univ. (Germany)
Michael Merkel, Focus GmbH (Germany)
Gerd Schoenhense, Mainz Univ. (Germany)
Ulf Kleineberg, Bielefeld Univ. (Germany)
Published in SPIE Proceedings Vol. 6533:
23rd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)
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