
Proceedings Paper
Long-wavelength VCSELs for optical networks and trace-gas monitoringFormat | Member Price | Non-Member Price |
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Paper Abstract
Long-wavelength InGaAlAs-InP vertical-cavity surface-emitting lasers (LW-VCSELs), designed for applications in gas
sensing and for optical interconnects are presented. These lasers cover the wavelength-range from 1.3 to 2.3 μm. With
2.3 μm, this is the longest wavelength ever achieved with an InP-based interband laser. Fabricated with a novel highspeed
design with reduced parasitics, bandwidths in excess of 11 GHz at 1.55 μm have been achieved. To the best of our
knowledge, this is the best dynamic characteristic for a 1.55 μm VCSEL ever presented. As a proof-of-concept one- and
two-dimensional arrays have been fabricated with high yield. All devices use for current confinement a buried tunnel
junction (BTJ). This concept, together with a dielectric backside reflector with integrated electroplated gold heat sink for
thermal management enables continuous wave (CW) operation at room-temperature with typical single-mode output
powers above 1 mW. The operation voltage is around 1 V and power consumption is as low as 10 - 20 mW. Error-free
data-transmission at 10 Gbit/s over 20 km is demonstrated, which can be readily applied in uncooled Coarse Wavelength
Division Multiplex Passive Optical Networks (CWDM PONs). The functionality of tunable diode laser spectroscopy
(TDLS) systems is verified by presenting a laser hygrometer using a 1.84 μm wavelength VCSEL.
Paper Details
Date Published: 25 September 2007
PDF: 13 pages
Proc. SPIE 6766, Optoelectronic Devices: Physics, Fabrication, and Application IV, 67660F (25 September 2007); doi: 10.1117/12.736660
Published in SPIE Proceedings Vol. 6766:
Optoelectronic Devices: Physics, Fabrication, and Application IV
Joachim Piprek; Jian J. Wang, Editor(s)
PDF: 13 pages
Proc. SPIE 6766, Optoelectronic Devices: Physics, Fabrication, and Application IV, 67660F (25 September 2007); doi: 10.1117/12.736660
Show Author Affiliations
W. Hofmann, Technische Univ. München (Germany)
G. Böhm, Technische Univ. München (Germany)
M. Ortsiefer, Vertilas GmbH (Germany)
M. Görblich, Technische Univ. München (Germany)
G. Böhm, Technische Univ. München (Germany)
M. Ortsiefer, Vertilas GmbH (Germany)
M. Görblich, Technische Univ. München (Germany)
C. Lauer, Technische Univ. München (Germany)
N. H. Zhu, Institute of Semiconductors (China)
M.-C. Amann, Technische Univ. München (Germany)
N. H. Zhu, Institute of Semiconductors (China)
M.-C. Amann, Technische Univ. München (Germany)
Published in SPIE Proceedings Vol. 6766:
Optoelectronic Devices: Physics, Fabrication, and Application IV
Joachim Piprek; Jian J. Wang, Editor(s)
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