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Proceedings Paper

Contact angles and liquid loss behavior of high index fluids
Author(s): Paul M. Harder; Timothy A. Shedd
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Paper Abstract

To achieve the numerical aperture required for the next generation of immersion lithography, water may be replaced with a high index liquid as the immersion fluid. Due to their low surface tension to viscosity ratios, candidate high index fluids have an increased tendency to lose liquid from the underlens region during scanning. Since any residual liquid left on the wafer is a potential defect mechanism, the conversion to high index fluids may drastically reduce scanning speeds and chip throughput. The mechanism for liquid loss strongly depends on the behavior of the three-phase contact line, so this work focuses on the experimental study of the static and dynamic contact behavior of five high index fluids. Contact angle and critical liquid loss velocity data is compared to the critical velocity model we previously developed, and the liquid loss behavior is discussed.

Paper Details

Date Published: 3 May 2007
PDF: 12 pages
Proc. SPIE 6533, 23rd European Mask and Lithography Conference, 653305 (3 May 2007); doi: 10.1117/12.734338
Show Author Affiliations
Paul M. Harder, Univ. of Wisconsin, Madison (United States)
Timothy A. Shedd, Univ. of Wisconsin, Madison (United States)

Published in SPIE Proceedings Vol. 6533:
23rd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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