
Proceedings Paper
Warpage of thin wafers using computer aided reflection moire methodFormat | Member Price | Non-Member Price |
---|---|---|
$17.00 | $21.00 |
Paper Abstract
To cope with advances in the electronic packaging industry, thinner wafers are being widely employed to produce
thinner packages. However, this has lead to an increase in random cracks during the wafer singulation process, thus
reducing the yield of the overall production.
Large stresses are induced particularly during backside metal deposition. The wafers bend due to these stresses. This
residual stress due to warpage lead to cracks which will severely re-orient the residual stress distributions, thus,
weakening the mechanical and electrical properties of the singulated die.
In this study, Computer aided reflection moiré technique is adapted to further investigates the warpage induced on
wafers with different backside metallization (bare silicon, AuY, AuX). The backside metal on the wafer is then etched
to remove the residual stress. Residual stress due to the effect of warpage caused by different backside metallization has
been experimentally investigated and compared. Applicability of this technique to correlate with the random crack in
the die is further validated.
Paper Details
Date Published: 11 September 2007
PDF: 11 pages
Proc. SPIE 6672, Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies III, 667203 (11 September 2007); doi: 10.1117/12.732783
Published in SPIE Proceedings Vol. 6672:
Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies III
Angela Duparré; Bhanwar Singh; Zu-Han Gu, Editor(s)
PDF: 11 pages
Proc. SPIE 6672, Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies III, 667203 (11 September 2007); doi: 10.1117/12.732783
Show Author Affiliations
Chi Seng Ng, Infineon Technolgies (Malaysia)
Nanyang Technological Univ. (Singapore)
Kok Yau Chua, Infineon Technolgies (Malaysia)
Meng Tong Ong, Infineon Technolgies (Malaysia)
Nanyang Technological Univ. (Singapore)
Kok Yau Chua, Infineon Technolgies (Malaysia)
Meng Tong Ong, Infineon Technolgies (Malaysia)
Yoke Chin Goh, Infineon Technolgies (Malaysia)
Anand K. Asundi, Nanyang Technological Univ. (Singapore)
Anand K. Asundi, Nanyang Technological Univ. (Singapore)
Published in SPIE Proceedings Vol. 6672:
Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies III
Angela Duparré; Bhanwar Singh; Zu-Han Gu, Editor(s)
© SPIE. Terms of Use
