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Proceedings Paper

Stress behavior of ball grid array (BGA) studied by dynamic electronic speckle pattern interferometry (DESPI)
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Paper Abstract

In this study, behavior of ball grid arrays (BGA) under external cycling loading was studied. A loading system for inducing cycling stress to BGA was successfully built. Dynamic electronic speckle pattern interferometry (DESPI) with in-plane sensitivity and Hilbert transform for phase analysis was applied. The cycling deformation of one solder ball was measured continuously. Temporal, whole-field deformation on one solder ball was demonstrated.

Paper Details

Date Published: 18 June 2007
PDF: 5 pages
Proc. SPIE 6616, Optical Measurement Systems for Industrial Inspection V, 66162R (18 June 2007); doi: 10.1117/12.726094
Show Author Affiliations
Violeta Dimitrova Madjarova, Saitama Univ. (Japan)
Satoru Toyooka, Saitama Univ. (Japan)
Hiroyuki Chida, Saitama Univ. (Japan)
Hirofumi Kadono, Saitama Univ. (Japan)

Published in SPIE Proceedings Vol. 6616:
Optical Measurement Systems for Industrial Inspection V
Wolfgang Osten; Christophe Gorecki; Erik L. Novak, Editor(s)

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