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Proceedings Paper

The application of ultrasonic phased array system to the inspection of fillet weld of flat plate
Author(s): Baohua Shan; Hua Wang; Xin Wang; Zhongdong Duan; Jinping Ou
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Paper Abstract

The ultrasonic phased array inspection imaging system was developed in this paper, which is integrated on the basis of the each module and the exploitation of subsystem, it is made up of computer, ultrasonic circuit system, scanning device, phased array transducer and imaging software. The ultrasonic phased array inspection imaging system has the functions of controlling ultrasonic transmission and reception, controlling sound beam steering and focusing, controlling scanner moving, receiving flaw information and position formation, restructuring flaw image and commenting damage. Experiment was done on the fillet weld block of T shape flat plate with some artifical flaws using the ultrasonic phased array system, the flaws characteristic could be exactly estimated through comparing and analyzing the flaws position in B-scan image and the waveform feature in A-scan curve, and the flaws size could be measured from the image of C-scan and D-scan. Experiment results indicate that the flaws detected by the manual ultrasonic inspection technology could be found over again by the ultrasonic phased array inspection technology, the flaws size measured by the latter is close to the former, the whole trend of development of flaws are factually imaging by the latter.

Paper Details

Date Published: 5 March 2007
PDF: 8 pages
Proc. SPIE 6595, Fundamental Problems of Optoelectronics and Microelectronics III, 659522 (5 March 2007); doi: 10.1117/12.725803
Show Author Affiliations
Baohua Shan, Harbin Institute of Technology (China)
Hua Wang, Harbin Institute of Technology (China)
Xin Wang, Harbin Institute of Technology (China)
Zhongdong Duan, Harbin Institute of Technology (China)
Jinping Ou, Harbin Institute of Technology (China)
Dalian Univ. of Technology (China)

Published in SPIE Proceedings Vol. 6595:
Fundamental Problems of Optoelectronics and Microelectronics III
Yuri N. Kulchin; Jinping Ou; Oleg B. Vitrik; Zhi Zhou, Editor(s)

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