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Proceedings Paper

The development of affordable front-end hardware for mm-wave imaging using multilayer softboard technology
Author(s): Paul D. Munday; Jeff Powell; Dave Bannister; Paul J. Rice
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Paper Abstract

Millimetre-wave (mm-wave) imaging systems for a number of applications rely on a multitude of receiver modules mounted at the focal plane of focusing optics. Analysis shows that the receiver front-end forms a significant proportion of the overall cost of an imaging system restricting market take-up of commercial systems for security screening and all weather vision. The cost of imager front-ends can be significantly reduced by the use of low-cost multi-layer softboard technology used for RF printed circuit boards (PCBs) and new monolithic microwave integrated circuit (MMIC) chipsets with fewer MMIC devices. Modelled performance of W-band mm-wave imaging receiver using these techniques shows effective bandwidths of 38GHz and noise equivalent temperature difference (NETD) of 0.3K when using a 0.2ms integration time. This performance is achieved with a potential cost saving of about 60%.

Paper Details

Date Published: 1 May 2007
PDF: 8 pages
Proc. SPIE 6548, Passive Millimeter-Wave Imaging Technology X, 65480G (1 May 2007); doi: 10.1117/12.723783
Show Author Affiliations
Paul D. Munday, QinetiQ (United Kingdom)
Jeff Powell, QinetiQ (United Kingdom)
Dave Bannister, QinetiQ (United Kingdom)
Paul J. Rice, MMIC Solutions (United Kingdom)

Published in SPIE Proceedings Vol. 6548:
Passive Millimeter-Wave Imaging Technology X
Roger Appleby; David A. Wikner, Editor(s)

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