Proceedings Paper
Bonding technique of polymer layer with ceramic elements of analytical microsystems| Format | Member Price | Non-Member Price |
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Paper Abstract
The possibilities of the construction of microsystems using ceramics and polymers are presented in the paper. The technology of irreversible and reversible bonding of ceramic and polymer microsystems' layers was developed. The irreversible bonding is required only for microfluidic structures, in which samples and reagents are introduced into the system using pressure methods. For the systems with an electroosmotic reagents dosing adhesion forces between particular layers are enough to seal the microchannels. In both cases a glaze layer was screen-printed on ceramic plates to eliminate their surface roughness.
Paper Details
Date Published: 20 October 2006
PDF: 4 pages
Proc. SPIE 6348, Optoelectronic and Electronic Sensors VI, 63480P (20 October 2006); doi: 10.1117/12.721108
Published in SPIE Proceedings Vol. 6348:
Optoelectronic and Electronic Sensors VI
Tadeusz Pisarkiewicz, Editor(s)
PDF: 4 pages
Proc. SPIE 6348, Optoelectronic and Electronic Sensors VI, 63480P (20 October 2006); doi: 10.1117/12.721108
Show Author Affiliations
Michał Chudy, Warsaw Univ. of Technology (Poland)
Karol Malecha, Wroclaw Univ. of Technology (Poland)
Leszek Golonka, Wroclaw Univ. of Technology (Poland)
Adam Sosicki, Wroclaw Univ. of Technology (Poland)
Karol Malecha, Wroclaw Univ. of Technology (Poland)
Leszek Golonka, Wroclaw Univ. of Technology (Poland)
Adam Sosicki, Wroclaw Univ. of Technology (Poland)
Henryk Roguszczak, Wroclaw Univ. of Technology (Poland)
Małgorzata Jakubowska, Institute of Electronic Materials Technology (Poland)
Artur Dybko, Warsaw Univ. of Technology (Poland)
Zbigniew Brzózka, Warsaw Univ. of Technology (Poland)
Małgorzata Jakubowska, Institute of Electronic Materials Technology (Poland)
Artur Dybko, Warsaw Univ. of Technology (Poland)
Zbigniew Brzózka, Warsaw Univ. of Technology (Poland)
Published in SPIE Proceedings Vol. 6348:
Optoelectronic and Electronic Sensors VI
Tadeusz Pisarkiewicz, Editor(s)
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