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Proceedings Paper

Whole wafer imprint patterning using step and flash imprint lithography: a manufacturing solution for sub-100-nm patterning
Author(s): David Lentz; Gary Doyle; Mike Miller; Gerald Schmidt; Maha Ganapathisuramanian; Xiaoming Lu; Doug Resnick; Dwayne L. LaBrake
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Paper Abstract

Imprint lithography has been shown to be an effective technique for the replication of nano-scale features1. When the imprint material is a UV cross linkable liquid, it is possible to perform the patterning process at room temperature and ambient pressure, which enables good pattern fidelity, short processing times, and reduced process defectivity2. Imprinting whole wafers using drop on demand dispense techniques offers improved throughput and nanopatterning over wafer topography which can exceed 10 μm. Template fabrication of arbitrary whole wafer patterns offers unique challenges for 1x feature fabrication. The resolution and pattern area of the imprint approach is strictly dependent on the ability to create a 1X master template. This paper provides a detailed description of whole wafer templates, imprint patterning processes, and etch processes that have been employed to create a whole wafer archetype process through hard mask patterning. Particular attention is given to high volume manufacturing focused on whole wafer template fabrication, throughput and pattern fidelity. Step and Flash Imprint Lithography (S-FILTM) makes use of templates that can be fabricated with the same patterning and etch transfer processes that are used for manufacturing phase-shifting photo masks. In the case of whole wafer templates the master die pattern is fabricated using conventional techniques. The replicate template carries the full wafer die pattern imprinted by step and repeat using the master. The S-FIL/R process can be used for patterning the replicate template3. The structure, pattern fidelity and critical dimension uniformity of the master and replicate templates and patterned wafer is shown to be within measurement errors.

Paper Details

Date Published: 16 March 2007
PDF: 10 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65172F (16 March 2007); doi: 10.1117/12.720671
Show Author Affiliations
David Lentz, Molecular Imprints, Inc. (United States)
Gary Doyle, Molecular Imprints, Inc. (United States)
Mike Miller, Molecular Imprints, Inc. (United States)
Gerald Schmidt, Molecular Imprints, Inc. (United States)
Maha Ganapathisuramanian, Molecular Imprints, Inc. (United States)
Xiaoming Lu, Molecular Imprints, Inc. (United States)
Doug Resnick, Molecular Imprints, Inc. (United States)
Dwayne L. LaBrake, Molecular Imprints, Inc. (United States)

Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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