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Proceedings Paper

Modular process modeling for OPC
Author(s): M. C. Keck; C. Bodendorf; T. Schmidtling; R. Schlief; R. Wildfeuer; S. Zumpe; M. Niehoff
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Paper Abstract

Modular OPC modeling, describing mask, optics, resist and etch processes separately is an approach to keep efforts for OPC manageable. By exchanging single modules of a modular OPC model, a fast response to process changes during process development is possible. At the same time efforts can be reduced, since only single modular process steps have to be re-characterized as input for OPC modeling as the process is adjusted and optimized. Commercially available OPC tools for full chip processing typically make use of semi-empirical models. The goal of our work is to investigate to what extent these OPC tools can be applied for modeling of single process steps as separate modules. For an advanced gate level process we analyze the modeling accuracy over different process conditions (focus and dose) when combining models for each process step - optics, resist and etch - for differing single processes to a model describing the total process.

Paper Details

Date Published: 28 March 2007
PDF: 9 pages
Proc. SPIE 6520, Optical Microlithography XX, 652044 (28 March 2007); doi: 10.1117/12.716295
Show Author Affiliations
M. C. Keck, Qimonda AG (Germany)
C. Bodendorf, Qimonda AG (Germany)
T. Schmidtling, Qimonda AG (Germany)
R. Schlief, Qimonda NA (United States)
R. Wildfeuer, Qimonda GmbH and Co. OHG (Germany)
S. Zumpe, Qimonda GmbH and Co. OHG (Germany)
M. Niehoff, Mentor Graphics Corp. (Germany)

Published in SPIE Proceedings Vol. 6520:
Optical Microlithography XX
Donis G. Flagello, Editor(s)

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