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Proceedings Paper

High speed IC design trends and optoelectronic packaging: a perspective on cost reduction
Author(s): Badri N. Gomatam
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Paper Abstract

Recent developments in IC design technology for high-speed communications have led to highly improved optoelectronic (O/E) system design. Specifically, signal integrity management is a specific area of communications circuit design that is promising in playing a role in optoelectronic packaging and component cost. This paper explores the potential of these techniques in impacting O/E component design and possibilities for cost reduction. It is argued that a judicious tradeoff in system parameters such as link length and component bandwidth could impact overall cost significantly.

Paper Details

Date Published: 9 February 2007
PDF: 5 pages
Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 64780H (9 February 2007);
Show Author Affiliations
Badri N. Gomatam, Vitesse Semiconductor Corp. (United States)


Published in SPIE Proceedings Vol. 6478:
Photonics Packaging, Integration, and Interconnects VII
Allen M. Earman; Ray T. Chen, Editor(s)

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