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Proceedings Paper

Major trends in extending CD-SEM utility
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Paper Abstract

Requirements for increasingly integrated metrology solutions continue to drive applications that incorporate process characterization tools, as well as the ability to improve metrology production capability and cycle time, with a single application. All of the most critical device layers today, along with even non-critical layers, now require optical proximity correction (OPC), which must be rigorously modeled and calibrated as part of process development and extensively verified once new product reticles are released using critical dimension-scanning electron microscopy (CD-SEM) tools. Automatic setup of complex recipes is one of the major trends in CD-SEM applications, which is adding much value to CD-SEM metrology. In addition, as integrated circuit dimensions continue to shrink, local line width variation influences the statistical confidence of a measured CD's representation of the process. A feature, called "Average CD (ACD)," measures multiple targets within the field of view (FOV). ACD allows not only measurements of a single data point representing one discrete feature, but also sampling of the mean and variance of the process. These two applications, automatic recipe creation and ACD, are combined in the second version of the DesignGauge software, which is available for the latest-generation Hitachi S-9380II CD-SEMs. DesignGauge V2 is not only capable of offline recipe creation and CD-SEM control, but it also has the ability to directly transfer design-based recipes into standard CD-SEM recipes. These recipes can be used for OPC model-building and verification as with previous DesignGauge applications. The software also provides design template-based recipe setup for production layer recipes, which yields much needed improvement to production tool utilization, as production recipes can thus be written offline for new products, improving first silicon cycle time, reducing engineering time required to generate recipes, and improving CD-SEM utilization. Another benefit of the application is an improvement in recipe robustness over conventional direct image-based pattern recognition. This work will show an extensive evaluation of DesignGauge V2, including rigorous tests of navigation, pattern recognition success rates, SEM image placement, throughput of recipe creation, and recipe execution. The impact of ACD will also be evaluated.

Paper Details

Date Published: 5 April 2007
PDF: 12 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651835 (5 April 2007); doi: 10.1117/12.714193
Show Author Affiliations
Benjamin Bunday, International SEMATECH Manufacturing Initiative (United States)
John Allgair, International SEMATECH Manufacturing Initiative (United States)
Kyoungmo Yang, Hitachi High-Technologies Corp. (Japan)
Shunsuke Koshihara, Hitachi High-Technologies Corp. (Japan)
Hidetoshi Morokuma, Hitachi High-Technologies Corp. (Japan)
Alex Danilevsky, Hitachi High Technologies America, Inc. (United States)
Cindy Parker, Hitachi High Technologies America, Inc. (United States)
Lorena Page, Hitachi High Technologies America, Inc. (United States)

Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)

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