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Proceedings Paper

Tin inventory for HVM EUVL sources
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Paper Abstract

Tin is one of the most efficient source materials for both gas discharge plasma sources and laser produced plasma sources for EUV lithography. Unlike Xenon which was the material commonly investigated for the EUVL source application, recycling of the target materials is not necessary for tin targets because of its low relative cost. However, in assessing the benefits of different source architectures, there are large differences in the size of the tin inventory used, and consequences that ensue. In this paper we make a first attempt to compare these differences, and assess their impact. Utilizing tin as the radiator at 13.5 nm reduces the total cost of the source system significantly.

Paper Details

Date Published: 15 March 2007
PDF: 8 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65170S (15 March 2007); doi: 10.1117/12.713463
Show Author Affiliations
Martin C. Richardson, College of Optics & Photonics/Univ. of Central Florida (United States)
Kazutoshi Takenoshita, College of Optics & Photonics/Univ. of Central Florida (United States)
Tobias Schmid, College of Optics & Photonics/Univ. of Central Florida (United States)

Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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