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TEM calibration methods for critical dimension standardsFormat | Member Price | Non-Member Price |
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Paper Abstract
One of the key challenges in critical dimension (CD) metrology is finding suitable calibration standards. Over the last
few years there has been some interest in using features measured with the transmission electron microscope (TEM) as
primary standards for linewidth measurements. This is because some modes of TEM can produce lattice-resolved
images having scale traceability to the SI (Systeme International d'Unites or International System of Units) definition of
length through an atomic lattice constant. As interest in using calibration samples that are closer to the length scales
being measured increases, so will the use of these TEM techniques.
An area where lattice-traceable images produced by TEM has been used as a primary standard is in critical dimension
atomic force microscope (CD-AFM) tip width calibration. Two modes of TEM that produce crystal lattice-traceable
images are high resolution transmission electron microscope (HR-TEM) and high angle annular dark field scanning
transmission electron microscope (HAADF-STEM). HR-TEM produces lattice-traceable images by interference
patterns of the diffracted and transmitted beams rather than the actual atomic columns, while HAADF-STEM produces
direct images of the crystal lattice. The difference in how both of these techniques work could cause subtle variations in
the way feature edges are defined.
In this paper, we present results from width samples measured using HR-TEM and HAADF-STEM. Next we compare
the results with measurements taken from the same location by two different CD-AFMs.
Both of the CD-AFM instruments used for this work have been calibrated using a single crystal critical dimension
reference material (SCCDRM). These standards, developed by the National Institute of Standards and Technology
(NIST) and SEMATECH, used HR-TEM for traceable tip-width calibration. Consequently, the present work and the
previous SCCDRM work provide a mutual cross-check on the traceability of the width calibration. Excellent agreement
was observed.
Paper Details
Date Published: 5 April 2007
PDF: 10 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651810 (5 April 2007); doi: 10.1117/12.713368
Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)
PDF: 10 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651810 (5 April 2007); doi: 10.1117/12.713368
Show Author Affiliations
Ndubuisi G. Orji, National Institute of Standards and Technology (United States)
Ronald G. Dixson, National Institute of Standards and Technology (United States)
Domingo I. Garcia-Gutierrez, Advanced Technology Development Facility (United States)
Benjamin D. Bunday, International SEMATECH Manufacturing Initiative (United States)
Ronald G. Dixson, National Institute of Standards and Technology (United States)
Domingo I. Garcia-Gutierrez, Advanced Technology Development Facility (United States)
Benjamin D. Bunday, International SEMATECH Manufacturing Initiative (United States)
Michael Bishop, International SEMATECH Manufacturing Initiative (United States)
Michael W. Cresswell, National Institute of Standards and Technology (United States)
Richard A. Allen, National Institute of Standards and Technology (United States)
John A. Allgair, International SEMATECH Manufacturing Initiative (United States)
Michael W. Cresswell, National Institute of Standards and Technology (United States)
Richard A. Allen, National Institute of Standards and Technology (United States)
John A. Allgair, International SEMATECH Manufacturing Initiative (United States)
Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)
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