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Proceedings Paper

Photocurable silicon-based materials for imprinting lithography
Author(s): Jianjun Hao; Michael W. Lin; Frank Palmieri; Yukio Nishimura; Huang-Lin Chao; Michael D. Stewart; Austin Collins; Kane Jen; C. Grant Willson
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Paper Abstract

Step and flash imprint lithography (SFIL) is low cost, high resolution patterning process and has found its way into a multitude of front end of the line (FEOL) and back end of the line (BEOL) applications. SFIL-R, a reverse tone variant of SFIL, and imprintable dielectrics are examples of such applications, and both require the design of specialized, silicon-based materials. Polyhedral oligomeric silsesquioxane (POSS) liquids were modified through a dual functionalization strategy to introduce photosensitive acrylate and thermally curable benzocyclobutane (BCB) groups to the molecule. The optimal functional group ratio was observed to be 3:5 acrylate to BCB, and the result was an imprintable dielectric with good mechanical properties and minimal post-exposure shrinkage. Thermal gravimetric analysis (TGA) revealed good thermal stability with minimal mass loss under annealing conditions of 400°C for 2 hours. Si-14 was designed to be a non-volatile, etch-resistant planarization layer for SFIL-R application. A polydimethylsiloxane (PDMS) derivative was modified to introduce acrylate functional groups and side branching for photosensitivity and low viscosity, respectively. Characterization of the material showed ideal planarization characteristics - low volatility (0.77 Torr at 25°C), low viscosity (15.1 cP), and minimal post-exposure shrinkage (5.1%).

Paper Details

Date Published: 21 March 2007
PDF: 9 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 651729 (21 March 2007); doi: 10.1117/12.712261
Show Author Affiliations
Jianjun Hao, The Univ. of Texas at Austin (United States)
Michael W. Lin, The Univ. of Texas at Austin (United States)
Frank Palmieri, The Univ. of Texas at Austin (United States)
Yukio Nishimura, The Univ. of Texas at Austin (United States)
Huang-Lin Chao, The Univ. of Texas at Austin (United States)
Michael D. Stewart, The Univ. of Texas at Austin (United States)
Austin Collins, The Univ. of Texas at Austin (United States)
Kane Jen, The Univ. of Texas at Austin (United States)
C. Grant Willson, The Univ. of Texas at Austin (United States)

Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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