
Proceedings Paper
Critical dimension measurements on phase-shift masks using an optical pattern placement metrology toolFormat | Member Price | Non-Member Price |
---|---|---|
$17.00 | $21.00 |
Paper Abstract
A useful extension of the optical mask pattern placement metrology is the measurement of critical dimensions (CD),
exploiting the outstanding mechanical resolution and stability of a corresponding mask metrology machine. In particular
the CD measurement on phase-shift masks (PSMs) poses a challenge on the optical measurement method. The paper
presents measurements and the corresponding computational modeling of the setup with respect to illumination beam
path (reflection, transmission), PSM properties and measurement optics for a dedicated edge detection method. Variables
have been the focus variation of the edge position and the critical dimension of the pattern. Based on the modeling
outcome the alignment and the illumination have been improved and verification measurements have been performed on
various machines of the type Vistec LMS IPRO3. The paper presents the measurements, the modeling and the
comparison to the practical measurement results for original and improved setup, showing the achievement of the
envisaged 2-nm repeatability.
Paper Details
Date Published: 5 April 2007
PDF: 10 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65183H (5 April 2007); doi: 10.1117/12.712129
Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)
PDF: 10 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65183H (5 April 2007); doi: 10.1117/12.712129
Show Author Affiliations
Hermann Bittner, Vistec Semiconductor Systems GmbH (Germany)
Dieter Adam, Vistec Semiconductor Systems GmbH (Germany)
Jochen Bender, Vistec Semiconductor Systems GmbH (Germany)
Dieter Adam, Vistec Semiconductor Systems GmbH (Germany)
Jochen Bender, Vistec Semiconductor Systems GmbH (Germany)
Artur Boesser, Vistec Semiconductor Systems GmbH (Germany)
Michael Heiden, Vistec Semiconductor Systems GmbH (Germany)
Klaus-Dieter Roeth, Vistec Semiconductor Systems GmbH (Germany)
Michael Heiden, Vistec Semiconductor Systems GmbH (Germany)
Klaus-Dieter Roeth, Vistec Semiconductor Systems GmbH (Germany)
Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)
© SPIE. Terms of Use
