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Proceedings Paper

DFM flow by using combination between design-based metrology system and model-based verification at sub-50nm memory device
Author(s): Cheol-kyun Kim; Jungchan Kim; Jaeseung Choi; Hyunjo Yang; Donggyu Yim; Jinwoong Kim
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Paper Abstract

As the minimum transistor length is getting smaller, the variation and uniformity of transistor length seriously effect device performance. So, the importance of optical proximity effects correction (OPC) and resolution enhancement technology (RET) cannot be overemphasized. However, OPC process is regarded by some as a necessary evil in device performance. In fact, every group which includes process and design, are interested in whole chip CD variation trend and CD uniformity, which represent real wafer. Recently, design based metrology systems are capable of detecting difference between data base to wafer SEM image. Design based metrology systems are able to extract information of whole chip CD variation. According to the results, OPC abnormality was identified and design feedback items are also disclosed. The other approaches are accomplished on EDA companies, like model based OPC verifications. Model based verification will be done for full chip area by using well-calibrated model. The object of model based verification is the prediction of potential weak point on wafer and fast feed back to OPC and design before reticle fabrication. In order to achieve robust design and sufficient device margin, appropriate combination between design based metrology system and model based verification tools is very important. Therefore, we evaluated design based metrology system and matched model based verification system for optimum combination between two systems. In our study, huge amount of data from wafer results are classified and analyzed by statistical method and classified by OPC feedback and design feedback items. Additionally, novel DFM flow would be proposed by using combination of design based metrology and model based verification tools.

Paper Details

Date Published: 21 March 2007
PDF: 7 pages
Proc. SPIE 6521, Design for Manufacturability through Design-Process Integration, 65210T (21 March 2007); doi: 10.1117/12.711953
Show Author Affiliations
Cheol-kyun Kim, Hynix Semiconductor, Inc. (South Korea)
Jungchan Kim, Hynix Semiconductor, Inc. (South Korea)
Jaeseung Choi, Hynix Semiconductor, Inc. (South Korea)
Hyunjo Yang, Hynix Semiconductor, Inc. (South Korea)
Donggyu Yim, Hynix Semiconductor, Inc. (South Korea)
Jinwoong Kim, Hynix Semiconductor, Inc. (South Korea)

Published in SPIE Proceedings Vol. 6521:
Design for Manufacturability through Design-Process Integration
Alfred K.K. Wong; Vivek K. Singh, Editor(s)

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