Share Email Print

Proceedings Paper

Study on micro-bubble defect induced by RRC coating
Author(s): Yu-Huan Liu; Wen-Shiang Liao; Hsin-Hung Lin; Chin-Jung Chen; C. C. Huang
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

RRC (Reducing resist consumption) coating is widely used to reduce photo resist consumption. By using solvent to pre-wet the wafer surface, photo resist can be coated on wafer easier than normal coating method. But it also can be the source of defects. In this study, we found that RRC solvent will induce micro-bubble and cause defects. Different methods had been tried to solve this kind of micro-bubble defects. Results showed that micro-bubble defects can be found when the wafer is static during RRC solvent dispense. And the defect map was a ring shape. The diameter of the rings depended on the RRC solvent dispense amount. Non micro-bubble defect was found, if wafer was spinning during RRC solvent dispense.

Paper Details

Date Published: 5 April 2007
PDF: 6 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65184L (5 April 2007); doi: 10.1117/12.711933
Show Author Affiliations
Yu-Huan Liu, United Microelectronics Corp. (Taiwan)
Wen-Shiang Liao, United Microelectronics Corp. (Taiwan)
Hsin-Hung Lin, United Microelectronics Corp. (Taiwan)
Chin-Jung Chen, United Microelectronics Corp. (Taiwan)
C. C. Huang, United Microelectronics Corp. (Taiwan)

Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?