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Proceedings Paper

Novel technology of automatic macro inspection for 32-nm node and best focus detection
Author(s): Kazuhiko Fukazawa; Kazumasa Endo; Kiminori Yoshino; Yuichiro Yamazaki
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Paper Abstract

As the semiconductor design rules shrink down, process margins are getting narrower, and thus, it is getting more important than ever to monitor pattern profile and detect minor structure variation. A breakthrough technology has been introduced as a solution to this concern. The new technology converts the fluctuation of polarization ingredient, which is caused by form birefringence, into light intensity variations as an optical image. This technology, which is called Pattern Edge Roughness (PER) inspection mode, is proved to be effective for 55nm production process. We also studied the possibility of the macro inspection method for half pitch 32nm technology node through FDTD method.

Paper Details

Date Published: 5 April 2007
PDF: 7 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65182H (5 April 2007); doi: 10.1117/12.711410
Show Author Affiliations
Kazuhiko Fukazawa, Nikon Corp. (Japan)
Kazumasa Endo, Nikon Corp. (Japan)
Kiminori Yoshino, Toshiba Corp. (Japan)
Yuichiro Yamazaki, Toshiba Corp. (Japan)

Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)

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