Airborne molecular contamination (AMC) continues to play a very decisive role in the performance of many microelectronic devices and manufacturing processes. Besides airborne acids and bases, airborne organic contaminants such as 1-methyl-2-pyrrolidinone (NMP), hexamethyldisiloxane (HMDSO), trimethylsilanol (TMS), perfluoroalkylamines and condensables are of primary concern in these applications. Currently, the state of the filtration industry is such that optimum filter life and removal efficiency for organics is offered by granular carbon filter beds. However, the attributes that make packed beds of activated carbon extremely efficient also impart issues related to elevated filter weight and pressure drop. Most of the lower pressure drop AMC filters currently offered are quite expensive and are simply pleated combinations of various adsorptive and reactive media. On the other hand, low pressure drop filters, such as those designed as open-channel networks (OCN's), offer good filter life and removal efficiency with the additional benefits of significant reductions in overall filter weight and pressure drop. Equally important for many applications, the OCN filters can reconstruct the airflow so as to enhance the operation of a tool or process. For tool mount assemblies and fan filter units (FFUs) this can result in reduced fan and blower speeds, which subsequently can provide reduced vibration and energy costs. Additionally, these low pressure drop designs can provide a cost effective way of effectively removing AMC in full fab (or HVAC) filtration applications without significantly affecting air-handling requirements. Herein, we will present a new generation of low pressure drop OCN filters designed for the removal of airborne organics in a wide range of applications.

Date Published: 5 April 2007
PDF: 11 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651846 (5 April 2007); doi: 10.1117/12.708302

Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)