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Proceedings Paper

Highly reliable hard soldered QCW laser diode stack packaging platform
Author(s): Paul Rosenberg; Patrick Reichert; Jihua Du; Michael Fouksman; Hailong Zhou; John McNulty; Sherry Tolman; Calvin Luong
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Paper Abstract

We describe the performance and reliability of multi-bar diode stacks assembled with hard solder attachment of the laser diode bar to the conduction-cooled package substrate. The primary stack package design is based on a modular platform that makes use of common piece parts to incorporate anywhere from 2-7 bars, operating at peak powers of 80W/bar to 200W/bar. In assembling monolithic type diode stack packages, it is typical to use a soft solder material such as indium for P-side bar attachment into the package. Due to its low melting point and low yield stress, indium can provide a solder joint that transfers low stress to the laser bar. However, during CW and QCW operation, indium is prone to migration that can cause device failure due to a number of well-known mechanisms. This shortcoming of soft-solder bar attachment can limit the number of shots the stack delivers over its operating life. By replacing the soft solder typically used for P-side attachment with a hard solder, it is possible to greatly reduce or eliminate certain failure modes, thereby increasing the operating life of the part. We demonstrate lifetime of > 1E9 shots at 80 W/bar, 250 us/40 Hz pulses, and 50C package operating temperature.

Paper Details

Date Published: 7 February 2007
PDF: 10 pages
Proc. SPIE 6456, High-Power Diode Laser Technology and Applications V, 645618 (7 February 2007); doi: 10.1117/12.701303
Show Author Affiliations
Paul Rosenberg, Coherent, Inc. (United States)
Patrick Reichert, Coherent, Inc. (United States)
Jihua Du, Coherent, Inc. (United States)
Michael Fouksman, Coherent, Inc. (United States)
Hailong Zhou, Coherent, Inc. (United States)
John McNulty, Coherent, Inc. (United States)
Sherry Tolman, Coherent, Inc. (United States)
Calvin Luong, Coherent, Inc. (United States)

Published in SPIE Proceedings Vol. 6456:
High-Power Diode Laser Technology and Applications V
Mark S. Zediker, Editor(s)

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