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Proceedings Paper

Hybrid micro-optical system integration by laserbeam soldering
Author(s): Erik Beckert; Ramona Eberhardt; Henrik Banse; Andreas Tünnermann; Frank Buchmann; Matthias Fettke
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Paper Abstract

Longterm stable and high precise interconnections between small optical components and the optomechanical platform are mandatory for the assembly of complex and miniaturized optoelectronical systems. The approach discussed in this paper is to integrate optics and electronics on a common platform that is a ceramic Printed Circuit Board with embedded mounting structures for easy passive alignment of the optical components. Active alignment with higher accuracy can also be used, in both cases laserbeam soldering is the preferred and precise joining technology. Thin solder layers as well as solder bumps are used to create joints with an accuracy <±0.5 &mgr;m, suitable for singlemode coupling applications.

Paper Details

Date Published: 20 March 2007
PDF: 8 pages
Proc. SPIE 6459, Laser-based Micro- and Nanopackaging and Assembly, 645904 (20 March 2007); doi: 10.1117/12.699882
Show Author Affiliations
Erik Beckert, Fraunhofer IOF (Germany)
Ramona Eberhardt, Fraunhofer IOF (Germany)
Henrik Banse, Fraunhofer IOF (Germany)
Andreas Tünnermann, Fraunhofer IOF (Germany)
Frank Buchmann, Askion GmbH (Germany)
Matthias Fettke, PacTech GmbH (Germany)

Published in SPIE Proceedings Vol. 6459:
Laser-based Micro- and Nanopackaging and Assembly
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Friedrich G. Bachmann; Willem Hoving, Editor(s)

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