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Proceedings Paper

Process engineering and failure analysis of MEMS and MOEMS by digital holography microscopy (DHM)
Author(s): Frédéric Montfort; Yves Emery; François Marquet; Etienne Cuche; Nicolas Aspert; Eduardo Solanas; Alexandre Mehdaoui; Adrian Ionescu; Christian Depeursinge
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Paper Abstract

Process engineering and failure analysis of MEMS and MOEMS require static and dynamical characterization of both their in-plane and out of plane response to an excitation. A remarkable characteristic of Digital Holography Microscopes (DHM) is the extremely short acquisition time required to grab the whole information necessary to provide 3D optical topography of the sample: a unique frame grab, without any vertical or lateral scan provides the information over the full field of view. First, it ensures DHM measurements to be insensitive to vibrations. Second, it opens the door to fast dynamical characterization of micro-systems. For periodic movement analysis, DHM can operate in stroboscopic mode with standard cameras. It enables precise characterization up to excitation frequencies of 100 kHz with recovery cycle of 10% simply by triggering properly the camera. Pulsed sources can be used for investigation of higher excitation frequencies. For non periodic movement analysis fast acquisition cameras and postponed treatment are used. DHM are therefore unique and very efficient tool for dynamical characterization of in-plane and out-of-plane response. In this paper we show the basics of the technology and illustrate process engineering and failure analysis using DHM with an example of in and out of plane characterization of movements of a variable capacitor using the stroboscopic mode of acquisition.

Paper Details

Date Published: 19 January 2007
PDF: 7 pages
Proc. SPIE 6463, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI, 64630G (19 January 2007); doi: 10.1117/12.699837
Show Author Affiliations
Frédéric Montfort, Lyncée Tec SA (Switzerland)
Yves Emery, Lyncée Tec SA (Switzerland)
François Marquet, Lyncée Tec SA (Switzerland)
Etienne Cuche, Lyncée Tec SA (Switzerland)
Nicolas Aspert, Lyncée Tec SA (Switzerland)
Eduardo Solanas, Lyncée Tec SA (Switzerland)
Alexandre Mehdaoui, STI-LEG-CMI, EPFL (Switzerland)
Adrian Ionescu, STI-LEG-CMI, EPFL (Switzerland)
Christian Depeursinge, STI-IOA, EPFL (Switzerland)

Published in SPIE Proceedings Vol. 6463:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
Allyson L. Hartzell; Rajeshuni Ramesham, Editor(s)

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