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Proceedings Paper

Fabrication of embedded conductive layer in polymer by plasma immersion ion implantation
Author(s): Peter C. T. Ha; Z. J. Han; B. K. Tay
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Paper Abstract

Plasma immersion ion implantation (PIII) offers an alternative to ion beam with the advantage of high implantation rate. However, problems inherent to the application of PIII to non-conducting materials such as polymers are due to surface charging. To overcome these difficulties and to have a controllable implantation depth, we sputtered a thin layer of gold before PIII is applied to the polymer substrate. The result is a controllable implantation dept and stronger adhesion between the metal-polymer interfaces. The extent of implantation depth can be correlated to tribological properties, electrical conductivity and Raman spectroscopy. While conductive AFM confirmed the conductivity of the embedded layer, the future applications, difficulties and limitations using this technique for fabrication of conductive embedded layer in polymers are also discussed.

Paper Details

Date Published: 22 December 2006
PDF: 6 pages
Proc. SPIE 6413, Smart Materials IV, 64130V (22 December 2006); doi: 10.1117/12.695666
Show Author Affiliations
Peter C. T. Ha, Nanyang Technological Univ. (Singapore)
Z. J. Han, Nanyang Technological Univ. (Singapore)
B. K. Tay, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 6413:
Smart Materials IV
Nicolas H. Voelcker, Editor(s)

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