Tin sulphide films with thickness of 500~1000 nm were deposited on ITO glass substrates at 30~150°C by a thermal evaporation technique. The films were characterized with X-ray diffraction (XRD), scanning electron microscopy (SEM) and atomic force microscopy (AFM) analysis. The vibrational property of the films was examined by Raman spectra. The SnS films are polycrystalline with a strong {111} preferred orientation, and they have orthorhombic crystal structure with a grain size of a few ten nanometers and exhibited near stoichiometric SnS composition. Their lattice parameters are a=0.4309~0.4313 nm, b=1.1263~1.1273 nm, c=0.3981~0.3990 nm which closely resembles those of bulk SnS at room temperature. And the substrate temperature has some influence on the composition and structure of the deposited films: when the substrate temperature increases from 30°C to 150°C, the grains in the films become smaller and the crystallinity has been improved. sulphide films with thickness of 500~1000 nm were deposited on ITO glass substrates at 30~150°C by a thermal evaporation technique. The films were characterized with X-ray diffraction (XRD), scanning electron microscopy (SEM) and atomic force microscopy (AFM) analysis. The vibrational property of the films was examined by Raman spectra. The SnS films are polycrystalline with a strong {111} preferred orientation, and they have orthorhombic crystal structure with a grain size of a few ten nanometers and exhibited near stoichiometric SnS composition. Their lattice parameters are a=0.4309~0.4313 nm, b=1.1263~1.1273 nm, c=0.39810~.3990 nm which closely resembles those of bulk SnS at room temperature. And the substrate temperature has some influence on the composition and structure of the deposited films: when the substrate temperature increases from 30°C to 150°C, the grains in the films become smaller and the crystallinity has been improved.

Date Published: 20 December 2006
PDF: 8 pages
Proc. SPIE 6415, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III, 641512 (20 December 2006); doi: 10.1117/12.694343

Published in SPIE Proceedings Vol. 6415:
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III
Jung-Chih Chiao; Andrew S. Dzurak; Chennupati Jagadish; David Victor Thiel, Editor(s)