Share Email Print

Proceedings Paper

Multi-layer resist system for 45-nm-node and beyond: part I
Author(s): M. Hashimoto; H. Shiratori; K. Horii; Y. Yokoya; Y. Ohkubo; H. Takamizawa; Y. Fujimura; J. Morimoto; A. Manoshiro; M. Shimizu; T. Yokoyama; T. Enomoto; M. Nagai
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The mask-making process for 45nm-node and beyond demands higher resolution and CD accuracy. To meet the requirements, the multi-layer resist system is developed as one of the solutions. BIL (Bottom Insulating Layer) can correct the profile of CAR (Chemically Amplified Resist). CAR shows profile degradation by photo-acid loss at the boundary of chrome and resist. The photo-acid loss induces excess footing in positive-tone CAR and under-cutting in negative-tone CAR. BIL reduced the profile degradation to less than half of the conventional resist system. BIL requires no extra mask process steps. Final CD linearity of isolated lines was improved by BIL. It is very beneficial for the patterning of sub-resolution assist features. Moreover, BIL with a hard-mask layer showed superior dry-etching bias performance.

Paper Details

Date Published: 20 October 2006
PDF: 10 pages
Proc. SPIE 6349, Photomask Technology 2006, 63490I (20 October 2006); doi: 10.1117/12.693131
Show Author Affiliations
M. Hashimoto, HOYA Corp. (Japan)
H. Shiratori, HOYA Corp. (Japan)
K. Horii, HOYA Corp. (Japan)
Y. Yokoya, HOYA Corp. (Japan)
Y. Ohkubo, HOYA Corp. (Japan)
H. Takamizawa, Dai Nippon Printing Corp. (Japan)
Y. Fujimura, Dai Nippon Printing Corp. (Japan)
J. Morimoto, Dai Nippon Printing Corp. (Japan)
A. Manoshiro, Dai Nippon Printing Corp. (Japan)
M. Shimizu, Dai Nippon Printing Corp. (Japan)
T. Yokoyama, Dai Nippon Printing Corp. (Japan)
T. Enomoto, Nissan Chemical Industries (Japan)
M. Nagai, Nissan Chemical Industries (Japan)

Published in SPIE Proceedings Vol. 6349:
Photomask Technology 2006
Patrick M. Martin; Robert J. Naber, Editor(s)

© SPIE. Terms of Use
Back to Top