
Proceedings Paper
Mask data volume: historical perspective and future requirementsFormat | Member Price | Non-Member Price |
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Paper Abstract
Mask data file sizes are increasing as we move from technology generation to generation. The historical 30% linear
shrink every 2-3 years that has been called Moore's Law, has driven a doubling of the transistor budget and hence feature
count. The transition from steppers to step-and-scan tools has increased the area of the mask that needs to be patterned.
At the 130nm node and below, Optical Proximity Correction (OPC) has become prevalent, and the edge fragmentation
required to implement OPC leads to an increase in the number of polygons required to define the layout. Furthermore,
Resolution Enhancement Techniques (RETs) such as Sub-Resolution Assist Features (SRAFs) or tri-tone Phase Shift
Masks (PSM) require additional features to be defined on the mask which do not resolve on the wafer, further increasing
masks volumes. In this paper we review historical data on mask file sizes for microprocessor, DRAM and Flash memory
designs. We consider the consequences of this increase in file size on Mask Data Prep (MDP) activities, both within the
Integrated Device Manufacturer (IDM) and Mask Shop, namely: computer resources, storage and networks (for file
transfer). The impact of larger file sizes on mask writing times is also reviewed. Finally we consider, based on the trends
that have been observed over the last 5 technology nodes, what will be required to maintain reasonable MDP and mask
manufacturing cycle times.
Paper Details
Date Published: 21 June 2006
PDF: 12 pages
Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 62810H (21 June 2006); doi: 10.1117/12.692639
Published in SPIE Proceedings Vol. 6281:
22nd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)
PDF: 12 pages
Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 62810H (21 June 2006); doi: 10.1117/12.692639
Show Author Affiliations
Chris Spence, Advanced Micro Devices, Inc. (United States)
Scott Goad, Advanced Micro Devices, Inc. (United States)
Peter Buck, Toppan Photomasks, Inc. (United States)
Richard Gladhill, Toppan Photomasks, Inc. (United States)
Scott Goad, Advanced Micro Devices, Inc. (United States)
Peter Buck, Toppan Photomasks, Inc. (United States)
Richard Gladhill, Toppan Photomasks, Inc. (United States)
Russell Cinque, Toppan Photomasks, Inc. (United States)
Jürgen Preuninger, IFX (Germany)
Üwe Griesinger, IFX (Germany)
Martin Blöcker, AMTC (Germany)
Jürgen Preuninger, IFX (Germany)
Üwe Griesinger, IFX (Germany)
Martin Blöcker, AMTC (Germany)
Published in SPIE Proceedings Vol. 6281:
22nd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)
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