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Proceedings Paper

Thermal effects of moisture inducing delamination in light-emitting diode packages
Author(s): Jianzheng Hu; Lianqiao Yang; Moo Whan Shin
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Paper Abstract

This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.

Paper Details

Date Published: 28 September 2006
PDF: 9 pages
Proc. SPIE 6355, Advanced LEDs for Solid State Lighting, 635516 (28 September 2006); doi: 10.1117/12.691555
Show Author Affiliations
Jianzheng Hu, Myongji Univ. (South Korea)
Lianqiao Yang, Myongji Univ. (South Korea)
Moo Whan Shin, Myongji Univ. (South Korea)

Published in SPIE Proceedings Vol. 6355:
Advanced LEDs for Solid State Lighting
Chang-Hee Hong; Tsunemasa Taguchi; Jung Han; Lianghui Chen, Editor(s)

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