Proceedings Paper
Simulation and realization of RCE photodiode with transparent and unique pattern ohmic contact microstructure| Format | Member Price | Non-Member Price |
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Paper Abstract
In order to resolve the trade-off between quantum efficiency and response speed in resonant cavity enhanced (RCE) photodiode, the scheme of the transparent and unique pattern ohmic contact (TUPOC) microstructure was proposed. This scheme can be used for improving device's response speed by reducing the diode capacitance without influencing quantum efficiency. Three kinds of the TUPOC microstructures were proposed and simulated, the first one was realized. The response speed of the finished device with mesa area of 50×50μm2 is remarkably increased, 3dB bandwidth of 18GHz has been demonstrated, but the device without the TUPOC microstructure only have 3dB bandwidth of 9.47GHz.
Paper Details
Date Published: 6 October 2006
PDF: 8 pages
Proc. SPIE 6352, Optoelectronic Materials and Devices, 635232 (6 October 2006); doi: 10.1117/12.687941
Published in SPIE Proceedings Vol. 6352:
Optoelectronic Materials and Devices
Yong Hee Lee; Fumio Koyama; Yi Luo, Editor(s)
PDF: 8 pages
Proc. SPIE 6352, Optoelectronic Materials and Devices, 635232 (6 October 2006); doi: 10.1117/12.687941
Show Author Affiliations
Yiqun Li D.D.S., Beijing Univ. of Posts and Telecommunications (China)
Yongqing Huang, Beijing Univ. of Posts and Telecommunications (China)
Ang Miao, Beijing Univ. of Posts and Telecommunications (China)
Yongqing Huang, Beijing Univ. of Posts and Telecommunications (China)
Ang Miao, Beijing Univ. of Posts and Telecommunications (China)
Jihe Lv, Beijing Univ. of Posts and Telecommunications (China)
Hui Huang, Beijing Univ. of Posts and Telecommunications (China)
Xiaomin Ren, Beijing Univ. of Posts and Telecommunications (China)
Hui Huang, Beijing Univ. of Posts and Telecommunications (China)
Xiaomin Ren, Beijing Univ. of Posts and Telecommunications (China)
Published in SPIE Proceedings Vol. 6352:
Optoelectronic Materials and Devices
Yong Hee Lee; Fumio Koyama; Yi Luo, Editor(s)
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