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Proceedings Paper

Integration of optical isolators and semiconductor lasers by wafer bonding
Author(s): Tetsuya Mizumoto; Kazumasa Sakurai; Yuya Shoji; Hideki Saito
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Paper Abstract

We developed a technique of bonding magneto-optic garnets to III/V compound semiconductors for integrating an optical isolator with a semiconductor optical device. Some approaches to realize an isolator integrated with a laser diode will be presented.

Paper Details

Date Published: 6 October 2006
PDF: 8 pages
Proc. SPIE 6352, Optoelectronic Materials and Devices, 63522B (6 October 2006); doi: 10.1117/12.687371
Show Author Affiliations
Tetsuya Mizumoto, Tokyo Institute of Technology (Japan)
Kazumasa Sakurai, Tokyo Institute of Technology (Japan)
Yuya Shoji, Tokyo Institute of Technology (Japan)
Hideki Saito, Tokyo Institute of Technology (Japan)

Published in SPIE Proceedings Vol. 6352:
Optoelectronic Materials and Devices
Yong Hee Lee; Fumio Koyama; Yi Luo, Editor(s)

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