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Proceedings Paper

High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring
Author(s): Wojciech J. Walecki; Alexander Pravdivtsev; Manuel Santos II; Ann Koo
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Paper Abstract

We present design of novel tool for characterization of wafer thickness and wafer topography employing fast low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.

Paper Details

Date Published: 14 August 2006
PDF: 5 pages
Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (14 August 2006);
Show Author Affiliations
Wojciech J. Walecki, Frontier Semiconductor (United States)
Alexander Pravdivtsev, Frontier Semiconductor (United States)
Manuel Santos II, Frontier Semiconductor (United States)
Ann Koo, Frontier Semiconductor (United States)

Published in SPIE Proceedings Vol. 6293:
Interferometry XIII: Applications
Erik L. Novak; Wolfgang Osten; Christophe Gorecki, Editor(s)

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